THIS SERVICE IS CERTIFIED TO MEET THESE REQUIREMENTS
*Not complete listing of available specs. Contact us for review and confirmation of your specification
USA Specifications
NADCAP Specifications
- AMS 2418
NON-NADCAP Specifications
- Not Certified at United States Facility
Mexico Specifications
NADCAP Specifications
- Not Certified in Mexico
NON-NADCAP Specifications
- Not Certified in Mexico
ELECTROLESS COPPER PLATING
Electroless copper is often used as base layer to apply a uniform deposit for metallizing non metallic substrates. Typical thickness ranges are between 40 and 200 microinches.
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Low Electrical Resistance
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Low Internal Stress
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Fine Grain Structure
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Bright Pink Color
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Corrosion Resistant
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Anti-Microbial
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Uniform Deposit
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Conductive
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Solderable
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Ductile
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Plastic
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Peek
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ABS
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Ultem