THIS SERVICE IS CERTIFIED TO MEET THESE REQUIREMENTS
*Not a complete listing of available specs. Contact us for review and confirmation of your specification
USA Specifications
NADCAP Specifications
- 580-0151-000
- 580-0225-000
- ASTM B545
- MIL-T-10727
NON-NADCAP Specifications
Mexico Specifications
NADCAP Specifications
- Not certified in Mexico
NON-NADCAP Specifications
- Not certified in Mexico
BISMUTH TIN ELECTROPLATING
As more countries move towards a lead-free legislation through WEEE, REACH and RoHS directives, bismuth tin electroplating (SnBi) has become a suitable lead-free alternative for limiting whisker growth in tin plating applications. Like its counterpart, the silver-gray bismuth tin is a high uniformity deposit that boasts outstanding solderability. INCERTEC bismuth tin baths range from a .5-3% bismuth deposit.
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Outstanding Solderability
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Prevents Tin Whiskers
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RoHS Alternative To Tin Lead
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High Uniformity Deposit
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Corrosion Protection
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Lead Free
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Aluminum
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Brass
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Copper
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Steel
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Stainless Steel
