THIS SERVICE IS CERTIFIED TO MEET THESE REQUIREMENTS
*Not a complete listing of available specs. Contact us for review and confirmation of your specification
USA Specifications
NADCAP Specifications
- MIL-P-81728
- AMS-P-81728
- 580-0482
- ASTM B545
NON-NADCAP Specifications
- ASTM B579
- AMS 2408
- 9902200
- M691376
Mexico Specifications
NADCAP Specifications
- Not certified in Mexico
NON-NADCAP Specifications
- Not certified in Mexico
TIN LEAD ELECTROPLATING
Tin lead electroplating (SnPb) is dull gray in appearance and utilized in many industries including aerospace, defense, fire protection and electronic applications for its corrosion protection and exceptional solderability. Using a tin lead co-deposit mitigates the growth of metal filaments that can occur in pure tin plating known as tin whiskers. Tin whiskers can cause shorts and arcs in electrical components by bridging tightly spaced elements of a circuit. INCERTEC offers tin lead electroplating in 60/40 and 90/10 applications.
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Outstanding Solderability
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Prevents Tin Whiskers
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High Uniformity Deposit
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Etch Resistant
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Good Electrical Conductivity
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Oxidation Resistant
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Abrasion Resistant
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Ductile
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Aluminum
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Brass
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Copper
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Steel
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Stainless Steel
